Example of Job Report    Ex1: Wedge bond, Wire 0.7mil x 2.36mil (60um) Bond-pad   To: AAA �C Engineer, Broadcom From: BBB -  IDAX Microelectronics Report Date:      1st  C/C/C  2nd  D/D/D Subject: Assembly Report �C Microwave Device     Job Scope Chip-On-Board Packaging, 5 Boards 62 wires/board x 5 boards Wedge bond, Alum 0.7 mil 2 Critical Wires of equal length   1st Report: C/C/C     1. Incoming Inspection     Incoming Board surface Observation: Many short fibers around SMDs corners Reason: Probably caused by the soldering operator using paper to wipe off the residual of solder flux Risk: Electric short IDAX Action: Use tape adhesive to Get those fibers off the board Suggestion: Remove fibers after wiping the flux Thoroughly with tape adhesive   Bonding Diagram     2. First Unit: Not Encapsulated Yet     Preparation Tagged  each board with a number from #1~#5 Attach die while constrain epoxy within the die size        Setup on W/B work-stage      Ground during Wire-Bond Operation         Side View                                               Machine View        Wire-Bond on Die Surface, North Part      Wire-Bond on Die surface, South Part      Wire-Bond on Die Surface, Central Part

	2nd Report: Job is done     1. Measured data     Chip, Device No: #W1(MP8M7) Thickness (Die+ Epoxy) 10.5 mil Chip Size 57 x 77 mil Bond-pad size 2.4mil (60um) x 2.7 mil Space between bond-pads 0.5 mil Critical wire length Per machine top View coordination & Calculation Top left Unit1 .04045�� Unit3? 0.4052�� Lower left .04045�� .04048��   2. Unit3     North Side, Unit3                                            South Side, Unit3         West Side, Unit2                                       East Side, Unit2         Encapsulated, Optical Clear       Comments Board Wire-bond area trace-ends Very narrow & small pitch Chip Bond-pad Size & pitch is very small Wires in west side of die is heavily populated Wire-bond Difficult Hard for automation & mass production

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