IDAX Serves

Interconnect (at chip level, between chips and substrate)
     • Wire-Bonding
        Wedge Bond & Ball Bond;
        Alum wire 0.7~2.0 mil Dia, Gold wire 0.7~1.0 mil Dia.;
        Pad size down to 2.5 x 2.0 mil;
        Gap between pads >= 0.5 mil
     • Flip Chip
        Chip size =< 5 mm square
     • Attach SMDs
        Soldering, down to size 0402, 0201

Design
     • Packaging design, Semi-conductor & Microelectronic Device
     • Board layout
     • Design for Manufacturing

Assembly
     • Device Packaging
       Open-Cavity Package DIP, SO, TO, LCC, QFP, QFN, PGA
     • Microelectronic Packaging
       COB, COF, Microwave Device, Hybrid

Related Services (X)
     • Engineering Experiments
     • Open/Short Test
     • Wire Pull Test, NPT or DPT
     • Manufacturing methods R&D
     • Small process machine design & development
     • Clean-Room design